Study of Wafermine™ for Post-bunionectomy or Abdominoplasty Pain
Phase 2
Completed
- Conditions
- AbdominoplastyAcute PainBunion
- Interventions
- Drug: PlacebosDrug: Wafermine™ 50 mgDrug: Wafermine™ 75 mgDrug: Wafermine™ 25 mg
- Registration Number
- NCT03246971
- Lead Sponsor
- iX Biopharma Ltd.
- Brief Summary
This study evaluates the safety and effectiveness of Wafermine™ for post-bunionectomy or post-abdominoplasty pain over a 24 hours period. For subjects undergoing bunionectomy, 2 out of 3 subjects will receive Wafermine™ and 1 out of 3 subjects will receive placebo. For subjects undergoing abdominoplasty, 3 out of 4 subjects will receive Wafermine™ and 1 out of 4 subjects will receive placebo.
- Detailed Description
Not available
Recruitment & Eligibility
- Status
- COMPLETED
- Sex
- All
- Target Recruitment
- 125
Inclusion Criteria
- Scheduled for a bunionectomy or mini abdominoplasty with no additional planned procedures.
- Good general health without clinically significant renal, hepatic, cardiac or respiratory disease, as determined by the Investigator.
Exclusion Criteria
- For those undergoing bunionectomy, other painful conditions involving the surgical foot.
- Positive lab values for Hepatitis B or C or HIV
Study & Design
- Study Type
- INTERVENTIONAL
- Study Design
- PARALLEL
- Arm && Interventions
Group Intervention Description Wafermine™ Wafermine™ 25 mg - Placebo Placebos - Wafermine™ Wafermine™ 50 mg - Wafermine™ Wafermine™ 75 mg -
- Primary Outcome Measures
Name Time Method Summed Pain Intensity Differences (SPID) using a Numerical Rating Scale 12 hours
- Secondary Outcome Measures
Name Time Method
Trial Locations
- Locations (1)
Lotus Clinical Research
🇺🇸Pasadena, California, United States